发明名称 METHOD FOR JOINING AND JOINED BODY
摘要 <P>PROBLEM TO BE SOLVED: To provide a method for joining two substrates each other using a joining film patterned in a fine pattern at low cost, and a joined body including a joining film joined by the same. <P>SOLUTION: The method for joining includes a step wherein a first substrate, a second substrate 22, and a third substrate 23 are prepared; a step wherein a liquid material containing a silicone material is applied and dried on the side of the first substrate having a liquid repellent properties to obtain a joining film 3 patterned in a predetermined pattern; a step wherein an adhesiveness is developed around the surface of the joining film 3, and the first substrate and the second substrate 22 are joined via the joining film 3; a step wherein the first substrate is separated from the second substrate 22 to transfer the joining film 3 from the first substrate to the second substrate 22; and a step wherein an adhesiveness is developed around the surface of the transferred joining film 3 and the second substrate 22 is joined to the third substrate 23 via the joining film 3 to obtain a joined body 1 including these substrates joined to each other. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010229272(A) 申请公布日期 2010.10.14
申请号 JP20090077812 申请日期 2009.03.26
申请人 SEIKO EPSON CORP 发明人 IMAMURA MINEHIRO;GOMI KAZUHIRO
分类号 C09J5/00;C09J183/10 主分类号 C09J5/00
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