| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a printed circuit board with reduced characteristic impedance of wiring pattern, and to provide a method of manufacturing the same. <P>SOLUTION: A base insulating layer 41 is formed on a suspension body portion 10, and write wiring patterns W1, W2 and read wiring patterns R1, R2 are formed on the base insulating layer 41. The write wiring pattern W2 and read wiring patterns R1, R2 are formed on a body region 51 of the base insulating layer 41, and the write wiring pattern W1 is formed on an auxiliary region 52 of the base insulating layer 41. The base insulating layer 41 is bent along a bent portion B1. Consequently, the write wiring pattern W1 is positioned above the write wiring pattern W2. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
