| 摘要 |
PROBLEM TO BE SOLVED: To provide a sheet-peeling device and method that peels off an adhesive sheet smoothly from an adherend, without giving stress to the adherend. SOLUTION: An adhesive sheet S is peeled off from a wafer W by making an edge part 46E roll in a direction where the wafer W is peeled off while allowing a pressing surface 461 to press tape T to an adhesive sheet S by rotating a pressing head 46. Therefore, a peeling device, featuring both smooth peeling that does not give stress to the wafer W like roller peeling and positive peeling like edge peeling, is realized. COPYRIGHT: (C)2011,JPO&INPIT |
