| 摘要 |
PROBLEM TO BE SOLVED: To provide an insulating resin composition having an excellent insulation property and adhesiveness with no occurrence of voids, and to provide semiconductor devices prepared using the composition. SOLUTION: The insulating resin composition contains a resin composition, insulating powder, and a curing agent. The resin composition is a resin composition (A) obtained by co-hydrolysis-condensation of an epoxy resin and an alkoxysilane compound represented by general formula (1): (R<SP>1</SP>)<SB>n</SB>-Si-(OR<SP>2</SP>)<SB>4-n</SB>. The alkoxysilane compound contains at least one alkoxysilane compound (B), represented by general formula (1) in which n is 1-2, that contains at least one cyclic ether group as R<SP>1</SP>, and at least one alkoxysilane compound (C), represented by general formula (1) in which n is 1-2, that contains at least one aryl group as R<SP>1</SP>, wherein the mixing index α of (B) and (C), which is represented by general formula (2): mixing index α=(αc)/(αb), is 0.001-19. COPYRIGHT: (C)2011,JPO&INPIT |
