| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board capable of achieving fineness. <P>SOLUTION: Since a build-up wiring layer can be formed on the surface of a low thermal expansion substrate 50 featuring excellent flatness, a conductor circuit 38 featuring fine wiring and excellent thickness accuracy can be formed, achieving a fine pitch. Further, by forming the build-up wiring layer 38 on a core substrate 12, high density and downsizing are achieved, allowing a thin plate to be obtained by reducing the number of layers. By making the low thermal expansion substrate 50 to be built-in, a via conductor 40 of the low thermal expansion substrate 50 can be connected with a via 46 through plating, enabling to enhance reliability. <P>COPYRIGHT: (C)2011,JPO&INPIT |
