发明名称 COMPOSITION FOR METAL PLATING COMPRISING SUPPRESSING AGENT FOR VOID FREE SUBMICRON FEATURE FILLING
摘要 <p>Composition comprising a source of metal ions and at least one suppressing agent obtainable by reacting a) an amine compound comprising at least three active amino functional groups with b) a mixture of ethylene oxide and at least one compound selected from C3 and C4 alkylene oxides.</p>
申请公布号 WO2010115796(A1) 申请公布日期 2010.10.14
申请号 WO2010EP54281 申请日期 2010.03.31
申请人 BASF SE;ROEGER, CORNELIA;RAETHER, ROMAN BENEDIKT;EMNET, CHARLOTTE;HAAG, ALEXANDRA;MAYER, DIETER 发明人 ROEGER, CORNELIA;RAETHER, ROMAN BENEDIKT;EMNET, CHARLOTTE;HAAG, ALEXANDRA;MAYER, DIETER
分类号 C25D3/38;C23C18/31;C23C18/32;C25D3/58;H01L21/288;H05K3/18;H05K3/24 主分类号 C25D3/38
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