SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME
摘要
PURPOSE: A semiconductor device and a manufacturing method thereof are provided to simplify a manufacturing process by not requiring an additional solder process and an additional via hole insulation layer. CONSTITUTION: A via hole is formed by removing the part of a substrate including a pad(408). An insulation layer is formed on the substrate. An opening unit including a plurality of openings to expose the part of pads is formed by removing the part of the insulation layer. A penetration electrode(440) is electrically connected to the pad through one opening and fills the via hole.