发明名称 |
APPARATUS AND METHOD FOR PRE-BONDING OF THE DRIVE INTEGRATED CIRCUIT |
摘要 |
PURPOSE: A device and a method for pre-bonding a drive IC(Integrated Circuit) are provided to align a drive IC after checking a location of the drive IC, thereby preventing error about a state of the liquid crystal display panel. CONSTITUTION: A conveyor(11) transfers an LCD(Liquid Crystal Display) panel to a stage(10) in the first direction. A mount head(20) pre-bonds a drive IC of the liquid crystal display panel. A transfer unit(30) transfers the mount head. A camera unit(50) recognizes a location by photographing the drive IC and the LCD panel. The mount head moves between the photographing location and the pre-bonded position. |
申请公布号 |
KR20100110501(A) |
申请公布日期 |
2010.10.13 |
申请号 |
KR20090028866 |
申请日期 |
2009.04.03 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
AN, SOO HO;LEE, JUN HEE;BACK, SANG HOON |
分类号 |
G02F1/13;G02F1/1345 |
主分类号 |
G02F1/13 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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