发明名称 APPARATUS AND METHOD FOR PRE-BONDING OF THE DRIVE INTEGRATED CIRCUIT
摘要 PURPOSE: A device and a method for pre-bonding a drive IC(Integrated Circuit) are provided to align a drive IC after checking a location of the drive IC, thereby preventing error about a state of the liquid crystal display panel. CONSTITUTION: A conveyor(11) transfers an LCD(Liquid Crystal Display) panel to a stage(10) in the first direction. A mount head(20) pre-bonds a drive IC of the liquid crystal display panel. A transfer unit(30) transfers the mount head. A camera unit(50) recognizes a location by photographing the drive IC and the LCD panel. The mount head moves between the photographing location and the pre-bonded position.
申请公布号 KR20100110501(A) 申请公布日期 2010.10.13
申请号 KR20090028866 申请日期 2009.04.03
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 AN, SOO HO;LEE, JUN HEE;BACK, SANG HOON
分类号 G02F1/13;G02F1/1345 主分类号 G02F1/13
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