| 摘要 |
PURPOSE: A negative photosensitivity resin composition, a pattern formation method of a display device using thereof, the display device or a semiconductor are provided to secure the excellent heat resistance, insulating property, and chemical resistance. CONSTITUTION: A non-solvent type negative photosensitivity resin composition contains the following: 10~80wt% of ethylene system monomer; 10~60wt% of crosslinkable monomer including more than two ethylene double bonds; 0.01~10wt% of photopolymerization initiator; and 0.1~10wt% of silicone-based surfactant or a fluoro-surfactant. The non-solvent type negative photosensitivity resin composition additionally contains a photo-sensitizer, a thermal polymerization inhibitor, or an antifoaming agent. |
