| 摘要 |
PURPOSE: A light emitting device including a plurality of light emitting cells and a manufacturing method thereof are provided to prevent an etching byproduct due to the patterning of a bonding metal layer by bonding a support substrate with an interlayer insulation layer. CONSTITUTION: A plurality of light emitting cells(LS1,LS2) are separated on the upper side of a support substrate(151) and include an upper semiconductor layer(125a), an active layer(127a), and a lower semiconductor layer(129a). Electrodes(E1,E2) are positioned between the support substrate and the light emitting cell. The electrodes include a reflective structure(133a,133b) and a protective metal layer(135a,135b). An interlayer insulation layer(137) has a relatively large thermal conductivity in comparison to a silver paste. A bonding metal(141,143) is interposed between the support substrate and the interlayer insulation layer. |
