| 摘要 |
<p>The invention provides an encapsulation method for an LED wafer. The method is to place a bracket carried with the LED wafer in a mould, and to form a silicagel lens covering the LED wafer on the bracket by a low-speed low-pressure ejection method. The method can not affect gold wires used in routing, therefore the yield of the quality is ensured. In addition, with the mechanical production process, the labor can be reduced substantially, the cost is reduced, and the production efficiency is improved.</p> |
