| 摘要 |
A ceramic electrostatic chuck according to the present invention includes a dielectric layer, a support layer in contact with the back side of the dielectric layer, and an embedded electrostatic electrode. A wafer can be placed on the dielectric layer. The dielectric layer is formed of sintered aluminum nitride containing Sm and has a volume resistivity in the range of 4×109 to 4×1010 &OHgr;cm at room temperature. The support layer is formed of sintered aluminum nitride containing Sm and Ce and has a volume resistivity of 1×1013 &OHgr;cm or more at room temperature.
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