发明名称 POSITIVE RESIST COMPOSITION, METHOD FOR FORMING RESIST PATTERN AND COMPOUND
摘要 <P>PROBLEM TO BE SOLVED: To provide a new compound useful for a resist composition, a positive resist composition containing the compound, and a method for forming a resist pattern by using the positive resist composition. <P>SOLUTION: The positive resist composition comprises: a substrate component (A) wherein solubility in an alkali developing solution is increased by action of an acid; and an acid generator component (B) that generates acid by exposure to light. The substrate component (A) comprises a compound (A1) represented by formula (A1-1) [wherein P is a group obtained by removing (n<SB>12</SB>+1) pieces of -OH from a polyhydric phenol compound having a molecular weight of 500-2,500; R<SP>1</SP>is an acid-dissociable dissolution inhibiting group; R<SP>2</SP>is a non-acid-dissociable group; and n<SB>12</SB>is an integer of 1-3]. <P>COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010222339(A) 申请公布日期 2010.10.07
申请号 JP20090234267 申请日期 2009.10.08
申请人 TOKYO OHKA KOGYO CO LTD 发明人 SHIONO HIROHISA;TAKAGI DAICHI
分类号 C07C69/712;G03F7/039;H01L21/027 主分类号 C07C69/712
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