| 摘要 |
PROBLEM TO BE SOLVED: To provide a multi-pattern wiring board that is divided along the dividing groove with high accuracy, and to provide a wiring board, a package for housing electronic components, and an electronic apparatus. SOLUTION: In a multi-pattern wiring board 1, a plurality of insulating layers 11-15 are laminated, and a plurality of board areas E<SB>11</SB>-E<SB>55</SB>to be divided as a wiring board is formed in a matrix. Dividing grooves S<SB>odd</SB>and S<SB>even</SB>are formed in a boarder part between the board areas E<SB>11</SB>-E<SB>55</SB>to each of the insulating layers 11-15. The dividing grooves S<SB>odd</SB>and S<SB>even</SB>have a first diving groove S<SB>odd</SB>formed in odd-numbered insulating layers 11, 13 and 15, and a second dividing groove S<SB>even</SB>formed in even-numbered insulating layers 12 and 14 and formed not to be overlapped with the first dividing groove S<SB>odd</SB>in a planar view. In the planar view, the first dividing groove S<SB>odd</SB>and the second dividing groove S<SB>even</SB>are adjacent to each other along a dividing direction. COPYRIGHT: (C)2011,JPO&INPIT
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