| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a method for forming a coating type film, by which an organic component derived from a solvent in a coating film can be removed even when a coating method is used. <P>SOLUTION: The method for forming a coating type film comprises a first step S1 of coating the surface of a substrate containing a semiconductor substrate W with a solution containing at least an organic metal compound, a second step S2 of heating a coating film to volatilize a solvent, and a third step S3 of removing impurities by treating the coating film via treatment involving at least one treatment selected from heat treatment, ozone treatment, and steam treatment. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
