发明名称 TRANSPARENT RESIN MOLDED ARTICLE HAVING HEAT RESISTANCE
摘要 PROBLEM TO BE SOLVED: To provide a transparent resin molded article having high heat resistance to withstand soldering reflow, excellent light stability and transparency to be used as an optical film. SOLUTION: The molded article of a resin composition includes a fluororesin having a melting point of≤200°C and transparency, and an additive having molecular weight of≤1,000 and at least two C-C double bonds in its molecule, and is in the form of a film having a thickness of≤250μm, wherein the resin composition is crosslinked by irradiation with an ionizing radiation. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010222540(A) 申请公布日期 2010.10.07
申请号 JP20090074510 申请日期 2009.03.25
申请人 SUMITOMO ELECTRIC IND LTD;SUMITOMO ELECTRIC FINE POLYMER INC 发明人 YAMAZAKI SATOSHI;HAYAMI HIROSHI;NAKABAYASHI MAKOTO
分类号 C08J7/00 主分类号 C08J7/00
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