| 摘要 |
A force sensor package (16) comprises the main parts: a MEMS force sensor (1); an interface circuit (2) converting the change of capacitance into an analog or digital sensor output signal; a substrate (3) on which the MEMS force sensor and the IC are attached to. The interface circuit (2) is a die in order to minimize the size of the force sensor. MEMS force sensor (1) and the interface circuit (2) are attached to the substrate (3) by an adhesive, e.g. glue. The electrical contacts are then realized by wire-bonding (10). Alternatively, said two parts may also be attached to the substrate (3) by a flip-chip process using solder. The setup allows to put over a protective cover (9, 14), which is not shown on the figure. |
