| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a package having a non-contact data carrier attached thereto. <P>SOLUTION: In a first embodiment of the package having the non-contact data carrier added thereto, the non-contact data carrier of a label shape is adhered to the package. In a second embodiment, the package has an antenna printed on the own package, and an IC chip is mounted to the antenna, and thus the non-contact data carrier is configured. In a third embodiment, a mold processed package 1 has an in-mold molded non-contact data carrier 31. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
