| 摘要 |
PROBLEM TO BE SOLVED: To obtain a substrate which is free of a crack with superior throughput by a method of thinning the substrate, and a substrate thinning device that thin the substrate to a prescribed finish thickness. SOLUTION: Through grinding and etching, the substrate W is thinned from its initial thickness Th0 to the desired finish thickness Thf. Surface roughness (Ry) of the substrate having been ground is preliminarily measured, and the thickness which is 10 times as large as the measured surface roughness is determined as a thickness Th1 by which the substrate is to be removed. A substrate reverse surface Wb is ground till the thickness reaches Th2(=Thf+Th1), and then etched by the thickness Th1 with an etchant to finally obtain the substrate having the thickness Thf. COPYRIGHT: (C)2011,JPO&INPIT
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