| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To obtain excellent connection reliability by lowering primary heating temperature of a thermosetting adhesive when an anisotropic conductive connection of an electric element with a wiring board is made using solder particles. <P>SOLUTION: When a connection structure formed by making the anisotropic conductive connection between the wiring board and electric element is manufactured, an adhesive obtained by dispersing solder particles of melting temperature Ts in the insulating acrylic thermosetting resin of minimum melting viscosity temperature Tv is used as an anisotropic conductive adhesive. In a first heating and pressing stage, the anisotropic conductive adhesive is molten to flow, pressed out of a gap between the wiring board and electronic element, and preliminarily set. In a second heating and pressing stage, the solder particles are molten to form a metal bond between an electrode of the wiring board and an electrode of the electric element, and the anisotropic conductive adhesive is primarily set. Here, relations of Tv<T1<Ts<T2 and P1>P2 are satisfied, where T1 is the heating temperature of the first heating and pressing stage and P1 is the pressing pressure; and T2 is the heating temperature of the second heating and pressing stage and P2 is the pressing pressure. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
