| 摘要 |
PROBLEM TO BE SOLVED: To provide a substrate processing method that can suppress production of particles more excellently. SOLUTION: The substrate processing method that uses a clamp ring for limiting a processing area for a workpiece to process the workpiece while limiting the processing area for the workpiece includes a process (t1) of mounting the workpiece on a mounting table having a heating mechanism, a process (t2) of heating the workpiece mounted on the mounting table up to target heating temperature using the heating mechanism, and a process (t3, A) of bringing the clamp ring for limiting the processing area for the workpiece into contact with the workpiece having reached the target heating temperature. COPYRIGHT: (C)2011,JPO&INPIT |
