发明名称 HEAT DISSIPATION MEMBER PRODUCING METHOD AND HEAT DISSIPATION MEMBER
摘要 PROBLEM TO BE SOLVED: To provide an excellent producing method of a heat sink using a plating method. SOLUTION: A step of dipping a copper substrate in a chromium plating bath to form a chromium layer, and then washing chromium plating liquid deposited on the chromium layer is performed. Next, a step of dipping in a copper plating bath to form a copper layer on the chromium layer is performed. These steps are repeated, resulting in the chromium layers being laminated on the copper substrate and the copper layers being laminated on the chromium layers, so that the heat sink is produced. The heat sink produced by the producing method appropriately responds to electronic components with advance in densification and miniaturization, and becomes inexpensive and industrially excellent. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2010226065(A) 申请公布日期 2010.10.07
申请号 JP20090097438 申请日期 2009.03.21
申请人 OKIDO MASAZUMI 发明人 OKIDO MASAZUMI;KAWADE YOSHIYUKI;KURODA KENSUKE;ICHINO RYOICHI;FUJII EIJI
分类号 H01L23/36;C25D5/12;C25D5/14;C25D7/00;H05K7/20 主分类号 H01L23/36
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