| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a heat radiation structure, in which a contact area of a heat conductive piece brought into contact with a heating component, and a heat dissipating member with which the heat conductive piece is to be in contact, is increased. <P>SOLUTION: The heat radiation structure of a heating element has an electronic device 1 which is the heating element, the heat conductive piece 2 brought into contact with the electronic device 1, and a support member 3 for supporting the heat conductive piece 2. The heat conductive piece 2 has an abutment piece 20 prolonged obliquely and upwardly from a surface contacting the electronic device 1. An opening 31 for fitting the heat conductive piece 2 is formed in the support member 3. A guide piece 30 which is substantially parallel to the abutment piece 20, and brought into face contact with the abutment piece 20, projects from the peripheral section of the opening 31. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
