INTEGRATED CIRCUIT PACKAGING SYSTEM WITH POST TYPE INTERCONNECTOR AND METHOD OF MANUFACTURE THEREOF

摘要

PURPOSE: An integrated circuit packaging system equipped with an interconnector of post type and a manufacturing method thereof are provided to improve the adhesive force and the aligning property between a conductive post and a bond pad by using a first conductive post and an interface. CONSTITUTION: A first device on a first substrate(106) and a second substrate(120) on the first device are arranged on a bottom package(104). The encapsulation material(124) having an opening on the second substrate is formed on the bottom package. A conductive post(122) is formed within the opening.