PURPOSE: A method for manufacturing a semiconductor package is provided to easily obtain marked information through a scanner by making information stored in an integrated production control system on the surface of a semiconductor package in a barcode type. CONSTITUTION: A printed circuit board is prepared(S110). Basic information for indentifying a semiconductor package is marked on a tag(S120). The basic information is stored in a storage medium(S130). The mounting process history of a semiconductor chip is stored in the storage medium(S140). The packaging process history of a semiconductor package is stored in the storage medium(S150). The information stored in the storage medium is marked on the semiconductor package in a barcode type(S160).
申请公布号
KR20100106104(A)
申请公布日期
2010.10.01
申请号
KR20090024559
申请日期
2009.03.23
申请人
SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人
HYEON, JEONG HO;CHO, GI SIK;KIM, YONG MIN;CHO, HUN IL;BEACK, HYUN SU;YEO, DONG HEE