发明名称 |
INTEGRATED CIRCUIT PACKAGING SYSTEM WITH INTERPOSER AND METHOD OF MANUFACTURE THEREOF |
摘要 |
A method of manufacture of an integrated circuit packaging system includes: providing an interposer having device contacts, interconnect contacts, and test pads including the interconnect contacts along an interconnect perimeter region of the interposer, the device contacts at a device perimeter region of the interposer with the device perimeter region within the interior of the interconnect perimeter region, and the test pads at a test perimeter region of the interposer with the test perimeter region encompassing the device perimeter region; and mounting an integrated circuit over the device contacts.
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申请公布号 |
US2010244024(A1) |
申请公布日期 |
2010.09.30 |
申请号 |
US20090411040 |
申请日期 |
2009.03.25 |
申请人 |
DO BYUNG TAI;CHUA LINDA PEI EE;OOI SHARON;PAGAILA REZA ARGENTY |
发明人 |
DO BYUNG TAI;CHUA LINDA PEI EE;OOI SHARON;PAGAILA REZA ARGENTY |
分类号 |
H01L23/482;H01L21/50;H01L21/56 |
主分类号 |
H01L23/482 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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