发明名称 |
CONDUCTIVE FOAMED SHEET AND CONDUCTIVE FOAMED RESIN CONTAINER |
摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a conductive foamed sheet suitable for applications in which the sheet comes in contact with members including a semiconductor element easily affected by corruption and electric damage and to provide a conductive foamed resin container suitable for holding such members. <P>SOLUTION: The conductive foamed sheet is formed in the shape of a sheet having a lamination structure which is formed by a foamed layer formed in a foamed state by a resin composition and non-foamed layers which are formed in a non-foamed state by a resin composition containing carbon black to be arranged on both sides of the foamed layer through the foamed layer. The conductive foamed sheet is formed to have a volume resistivity to be 1×10<SP>10</SP>Ωcm or more and 1×10<SP>13</SP>Ωcm or less by incorporating an antistatic agent in the resin composition forming the foamed layer. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
申请公布号 |
JP2010214625(A) |
申请公布日期 |
2010.09.30 |
申请号 |
JP20090061165 |
申请日期 |
2009.03.13 |
申请人 |
SEKISUI PLASTICS CO LTD |
发明人 |
ANAMI SHINICHI;GOSHOO KOJI;FURUKI TOSHINOBU |
分类号 |
B32B27/18;B32B5/18;B32B27/32;B65D1/00;B65D65/40;B65D85/86;C08J9/04;H01B1/24 |
主分类号 |
B32B27/18 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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