| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To simplify a process, to miniaturize wiring, and to relatively simply achieve further high-density mounting when manufacturing a wiring substrate with a semiconductor element or the like incorporated therein. <P>SOLUTION: A member composed by forming bumps 43 each having a projecting part on electrode pads 41 of a substrate 40A, and bringing a sheet-like member 51 into press contact with an insulation layer 44 to expose partial parts of the projecting parts 43b to the upper surface of the insulation layer 44 is segmented to provide electronic components 40. The electronic components 40 are rearranged in a second insulation layer and rewiring is executed. Rewiring is further executed to a member composed by forming a third insulation layer (in a semi-cured state) covering the insulation layer 44, thereafter superposing a first structure with a conductor to be connected to the projecting parts 43b through the rewiring formed therein on a second structure manufactured through a process similar to that of it, and thermally curing the third insulation layer to be integrated. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
