| 摘要 |
PURPOSE:To prevent deformation of a semiconductor device, and maintain specified quality, by cutting a lead frame into small frames before resin is cooled and hardened and its contraction force becomes large after resin sealing. CONSTITUTION:When the temperature of a lead frame 1 and cavity resin parts 2 decreases as little as possible, that is, at the time of a temperature wherein tension or compression does not operate, cutting parts 3 shown by arrows are so cut that stress is not applied to the cavity resin parts 2. The length of small lead frames 4-7 are made so short that the frames hardly suffer from influence, even if the temperature of the lead frame 1 and the cavity resin parts 1 decreases, and the resin begins to harden, or even if tension or compression due to expansion or contraction operates. Thereby, uniform quality can be obtained, even in the case where the difference of thermal expansion coefficients and that of thermal compressibility due to the difference of material between the lead frame 1 and the cavity resin parts 2 are large.
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