| 摘要 |
PROBLEM TO BE SOLVED: To provide a film forming method capable of reducing variations in a film thickness between substrates when forming a prescribed film by vaporizing and supplying a liquid film forming raw material containing an organic metal compound. SOLUTION: In the film forming method of forming a metal-containing film on a substrate by vaporizing a film forming raw material composed by diluting a hydrolytic organic metal compound with a solvent in a vaporizer and supplying the vaporized film forming raw material onto the substrate, a moisture content in the film forming raw material to be supplied to the vaporizer is turned to such an amount that the amount of hydrolysate generated by reaction with the organic metal compound does not practically clog a film forming raw material supply system including the vaporizer. COPYRIGHT: (C)2010,JPO&INPIT
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