| 摘要 |
<P>PROBLEM TO BE SOLVED: To improve the soldering properties of an Au-Ge alloy soldering ball for joining and sealing of an electronic component or the like. Ž<P>SOLUTION: The total content of metallic elements other than Au and Ge is controlled to <120 ppm in a range where the Au content in the Au-Ge alloy is 84.5 to 89.0 mass%, thereby a structure in which Ge fine grains are uniformly and finely dispersed is formed. In the vicinity of the eutectic composition of Ge, by suppressing the content of the impurities to the above range, the sphericity of the alloy ball is improved, and the development of Au primary crystals and dendrite is suppressed, thus the Au-Ge alloy ball composed of a uniform and even fine eutectic structure can be obtained. The Au-Ge alloy ball with this structure, has remarkably improved flowability and reduces a defect in soldering upon joining and sealing of an electronic component. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž
|
