| 摘要 |
A via design apparatus for designing a via providing connections between a plurality of layers inside a multilayer board includes: a determination section that determines a value of a shape parameter indicating a shape of a via in the multilayer board, the via having a hole passing through the plurality of layers and a conductive section on a side wall of the hole; and a calculation section that calculates a value of impedance of the via according to the value of the shape parameter.
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