发明名称 SOLID-STATE IMAGING DEVICE, METHOD OF MANUFACTURING THE SAME, AND ELECTRONIC APPARATUS
摘要 A solid-state imaging device includes a light sensing portion which is formed on a substrate and generates a signal electric charge according to incident light; a rectangular or gradient-index on-chip micro lens formed on a light incident side above the light sensing portion; and a planarized lens layer which covers the on-chip micro lens and is formed in such a manner that a light incident surface is planarized.
申请公布号 US2010243869(A1) 申请公布日期 2010.09.30
申请号 US20100728464 申请日期 2010.03.22
申请人 SONY CORPORATION 发明人 WANO HIROMI;TODA ATSUSHI;OTSUKA YOICHI;YAMAMOTO ATSUSHI
分类号 H01L31/0232;H01L27/14;H01L31/18;H04N5/335;H04N5/357;H04N5/359;H04N5/369;H04N5/372;H04N5/374 主分类号 H01L31/0232
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