发明名称 Thermally Conductive Silicone Composition
摘要 A thermally conductive silicone composition includes 25 to 50 volume % of a silicone, 30 to 60 volume % of a first heat conducting filler, and 20 to 40 volume % of a second heat conducting filler, and 1 to 2 volume % of a third heat conducting filler. The thermally conductive silicone composition has two heat conducting fillers with different sizes dispersed therein, thus the thermal impedance can be efficiently reduced.
申请公布号 US2010243949(A1) 申请公布日期 2010.09.30
申请号 US20100754598 申请日期 2010.04.05
申请人 NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY 发明人 WANG SEA-FUE;YEH CHUN-TING;WANG YUH-RUEY;LU HSI-CHUAN
分类号 C09K5/00 主分类号 C09K5/00
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