发明名称 |
COATED COPPER WIRE FOR BALL BONDING |
摘要 |
Provided is a coated copper wire for ball bonding wherein inconvenience due to oxidation of a Cu or Cu alloy core material can be avoided at the time of ball-up after tear-off. Also provided is a coated copper wire characterized in that the coated copper wire is a bonding wire having a core material consisting of a copper-phosphorus alloy, an intermediate layer consisting of palladium or platinum formed on the core material, and a skin layer consisting of gold formed on the intermediate layer. |
申请公布号 |
WO2010109693(A1) |
申请公布日期 |
2010.09.30 |
申请号 |
WO2009JP65227 |
申请日期 |
2009.09.01 |
申请人 |
TANAKA DENSHI KOGYO K.K.;YAMASHITA TSUTOMU;AKIMOTO HIDEYUKI;KUWAHARA TAKESHI;OKAZAKI JUNICHI |
发明人 |
YAMASHITA TSUTOMU;AKIMOTO HIDEYUKI;KUWAHARA TAKESHI;OKAZAKI JUNICHI |
分类号 |
H01L21/60 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|