发明名称 COATED COPPER WIRE FOR BALL BONDING
摘要 Provided is a coated copper wire for ball bonding wherein inconvenience due to oxidation of a Cu or Cu alloy core material can be avoided at the time of ball-up after tear-off. Also provided is a coated copper wire characterized in that the coated copper wire is a bonding wire having a core material consisting of a copper-phosphorus alloy, an intermediate layer consisting of palladium or platinum formed on the core material, and a skin layer consisting of gold formed on the intermediate layer.
申请公布号 WO2010109693(A1) 申请公布日期 2010.09.30
申请号 WO2009JP65227 申请日期 2009.09.01
申请人 TANAKA DENSHI KOGYO K.K.;YAMASHITA TSUTOMU;AKIMOTO HIDEYUKI;KUWAHARA TAKESHI;OKAZAKI JUNICHI 发明人 YAMASHITA TSUTOMU;AKIMOTO HIDEYUKI;KUWAHARA TAKESHI;OKAZAKI JUNICHI
分类号 H01L21/60 主分类号 H01L21/60
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