| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board that is suitable for miniaturization of a circuit and has a high connection reliability, and is processed by an existing manufacturing facility, and therefore is reduce in manufacturing cost, and also to provide a manufacturing method of the same. <P>SOLUTION: The multilayer printed wiring board is provided with: an insulation layer 2; and interconnection layers 1 and 3 (interconnection upper layer 1 and interconnection lower layer 3) formed on the front and rear faces of the insulation layer 2. A metal-coated resin ball 10 is put into a hole and is melted to fill in the hole for ensuring interlayer conductivity between the interconnection layers 1 and 3. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
