发明名称 |
SEMICONDUCTOR PACKAGE FABRICATION PROCESS AND SEMICONDUCTOR PACKAGE |
摘要 |
A substrate is provided with electrical connection pads on a front face and on a rear face, the front pads and rear pads being selectively connected via a network passing through the substrate. A peripheral edge of the substrate is mounted on a rigid annular frame and the rearm face secured to a suction table. A layer of a dielectric sealant containing electrically conductive particles is deposited on the front face and front pads of the substrate. Integrated-circuit chips are positioned on the front face to flatten the layer of dielectric sealant, the included electrically conductive particles making electrical connection between pads of the integrated-circuit and the front pads of the substrate. The resulting assembly in then encapsulated in a block of encapsulating material positioned on top of the front face of the substrate. The block is then diced in order to obtain a plurality of semiconductor packages. |
申请公布号 |
US2010244229(A1) |
申请公布日期 |
2010.09.30 |
申请号 |
US20100685457 |
申请日期 |
2010.01.11 |
申请人 |
STMICROELECTRONICS (GRENOBLE 2) SAS |
发明人 |
VITTU JULIEN |
分类号 |
H01L23/48;H01L21/56;H01L23/28 |
主分类号 |
H01L23/48 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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