| 发明名称 |
ADHESIVE FOR ELECTRONIC COMPONENT |
| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an adhesive for electronic component which has a high storage elastic modulus at a high temperature of a cured body, is excellent in wire-bonding property and has preferable coating property and anti-reflow cracking property. <P>SOLUTION: The adhesive for electronic component comprises: a polyfunctional epoxy compound; an episulfide compound; an imidazole compound wrapped by specific tetrakis phenol type compounds or dicarboxylic acid type compounds; and a specific acid-anhydride. <P>COPYRIGHT: (C)2010,JPO&INPIT</p> |
| 申请公布号 |
JP2010215863(A) |
申请公布日期 |
2010.09.30 |
| 申请号 |
JP20090067025 |
申请日期 |
2009.03.18 |
| 申请人 |
SEKISUI CHEM CO LTD |
发明人 |
HAYAKAWA AKINOBU;ISHIZAWA HIDEAKI;TAKEDA KOHEI;MASUI RYOHEI |
| 分类号 |
C09J163/00;C09J11/00;C09J11/06;C09J181/04;H01L21/52 |
主分类号 |
C09J163/00 |
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