METHOD OF LAMINATING FLEXIBLE FILM

摘要

<P>PROBLEM TO BE SOLVED: To provide a lamination method capable of furnishing a flexible film whose dimensional change is 0.01% or below even after exfoliation from a reinforcing plate and a method of producing a film circuit board using the same. Ž<P>SOLUTION: The method of laminating flexible film transfers the flexible film to the reinforcing plate by simultaneously pressing a flexible planar object and the flexible film after holding the flexible film on a surface of the flexible planar object and standing the flexible film face to face in a certain distance with an organic layer bearing surface of the reinforcing plate; wherein the lamination method is characterized by bringing an adhesive roll in contact with the flexible film on its surface to be stuck to the organic layer in a state where the flexible film is held on the surface of flexible planar object. Ž<P>COPYRIGHT: (C)2010,JPO&INPIT Ž