| 摘要 |
A solid-state imaging device includes, on a substrate, a lower electrode, a photoelectric converting layer that is disposed on the lower electrode, and an upper electrode that is disposed on the photoelectric converting layer. The device further includes: a boosting unit which is formed in the substrate, and which supplies a power supply voltage for producing an electric field between the upper electrode and the lower electrode; a wiring portion which electrically connects the output of the boosting unit to the upper electrode; and a low-pass filter which is connected to the output of the boosting unit, and which includes a resistor that is formed by at least a part of the wiring portion.
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