| 摘要 |
PROBLEM TO BE SOLVED: To provide a polishing device with good polishing efficiency, regarding the polishing device to polish a workpiece such as a semiconductor wafer. SOLUTION: This polishing device includes a chuck table for holding the workpiece and a polishing means for polishing the workpiece held by the chuck table, while supplying polishing liquid to the workpiece. The polishing means is constituted of a rotary spindle, a mount provided at one end of the rotary spindle and a polishing tool mounted on the mount. The polishing tool is constituted of a base mounted on the mount and a polishing pad mounted on the base. The polishing device includes an ultrasonic vibrator disposed in either one of the mount and the base of the polishing tool and a power supply means for impressing power on the ultrasonic vibrator. COPYRIGHT: (C)2010,JPO&INPIT |
