HEAT DISSIPATING INSULATING MATERIAL, MANUFACTURING METHOD THEREOF, AND LARGE CURRENT INDUCTOR

摘要

PROBLEM TO BE SOLVED: To provide both good coating property and good heat conductivity (heat dissipation) in addition to improved heat conductivity and heat dissipation, for contribution to improved quality (uniform quality).

SOLUTION: A silicone resin binder 100 [wt.%] is blended with a dispersant selected in a range of 0.01-50 [wt.%] in the silicone resin binder. A heat conductive filler, which has a particle size of 100-600 [wt.%] and is selected in the range of 0.1-20 [μm], is uniformity dispersed in the silicone resin binder 100 [wt.%]. Thus such composition has a dielectric strength of 14 [kV/mm] (where, 10 [kHz], cut-off current of 10 [mA]) or higher, and a viscosity of 0.05-3 [Pa s].

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