METHOD FOR FORMING PATTERN USING METAL FILM AND APPLICABLE ELEMENT THEREOF

摘要

PURPOSE: A method for forming a pattern using a metal film and an applicable element thereof are provided to remove environment pollution caused by a plating process by removing the planting process. CONSTITUTION: A predetermined sheet or a mold is formed(S110). A copper foil is coated on the surface of products through a sputtering method(S120). A pattern is formed by using a laser on the copper foil(S130). Copper is plated on the copper foil having the pattern to form an antenna having resistance below 1Ω(S140).