STACK TYPE SEMICONDUCTOR PACKAGE APPARATUS

摘要

PURPOSE: A stacked semiconductor package apparatus is provided to improve conductivity and prevent a solder joint defect. CONSTITUTION: A stacked semiconductor package apparatus includes a first semiconductor package(100), a second semiconductor package(200), and a signal connection member(10). The first semiconductor package comprises one or more first semiconductor chips and a first encapsulating material to protect the first semiconductor chip. The second semiconductor package includes one or more second semiconductor chips, a lead connected to the second semiconductor chip and a second encapsulating material. The signal connection member passes through the first encapsulating material of the first semiconductor package and connects the first semiconductor chip with the second semiconductor chip.