TEST SOCKET OF SEMICONDUCTOR DEVICE

摘要

PURPOSE: A test socket of a semiconductor device is provided to transfer a semiconductor device by rotation of a lower frame to perform an individual test, thereby reducing costs to personnel. CONSTITUTION: A rubber coupling groove(213) is formed on the center of the upper surface of a lower frame unit(210). At least one lead pin(214) is perpendicularly installed in the bottom of both ends of the rubber coupling groove. At least one transfer roller(212) is installed on an upper surface separated from both ends of the lower frame unit around the rubber coupling groove. At least one rubber unit includes at least one probe pin(224). At least one probe pin is electrically connected with the lead pin.