发明名称 |
Across reticle variation modeling and related reticle |
摘要 |
Methods of modeling across reticle variations and a related reticle are disclosed. One embodiment of the method includes defining a test for determination across a multiple chip wafer; identifying a measurement structure for performing the test; implementing the measurement structure on the multiple chip wafer using a reticle including the measurement structure between copies of the multiple chips on the reticle, wherein no one of the multiple chips covers an entirety of the reticle; performing the test on the multiple chip wafer using the measurement structure to acquire data across the reticle; using data from the performing to establish an across reticle variation model; and using the across reticle variation model to predict across chip variation for at least one of the multiple chips.
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申请公布号 |
US7803644(B2) |
申请公布日期 |
2010.09.28 |
申请号 |
US20070853976 |
申请日期 |
2007.09.12 |
申请人 |
INTERNATIONAL BUSINESS MACHINES CORPORATION |
发明人 |
BALCH BRUCE W.;BICKFORD JEANNE P.;HABIB NAZMUL;NGUYEN PHUNG T. |
分类号 |
H01L21/00 |
主分类号 |
H01L21/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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