发明名称 |
Overlay metrology and control method |
摘要 |
An overlay method for determining the overlay error of a device structure formed during semiconductor processing is disclosed. The overlay method includes producing calibration data that contains overlay information relating the overlay error of a first target at a first location to the overlay error of a second target at a second location for a given set of process conditions. The overlay method also includes producing production data that contains overlay information associated with a production target formed with the device structure. The overlay method further includes correcting the overlay error of the production target based on the calibration data.
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申请公布号 |
US7804994(B2) |
申请公布日期 |
2010.09.28 |
申请号 |
US20030367124 |
申请日期 |
2003.02.13 |
申请人 |
KLA-TENCOR TECHNOLOGIES CORPORATION |
发明人 |
ADEL MICHAEL;GHINOVKER MARK;KASSEL ELYAKIM;GOLOVANEVSKY BORIS;ROBINSON JOHN C.;MACK CHRIS A.;POPLAWSKI JORGE;IZIKSON PAVEL;PREIL MOSHE |
分类号 |
G01B11/00;G06K9/00;G01B21/00;G03F7/20;G03F9/00;H01L21/027;H01L21/66 |
主分类号 |
G01B11/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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