发明名称 Overlay metrology and control method
摘要 An overlay method for determining the overlay error of a device structure formed during semiconductor processing is disclosed. The overlay method includes producing calibration data that contains overlay information relating the overlay error of a first target at a first location to the overlay error of a second target at a second location for a given set of process conditions. The overlay method also includes producing production data that contains overlay information associated with a production target formed with the device structure. The overlay method further includes correcting the overlay error of the production target based on the calibration data.
申请公布号 US7804994(B2) 申请公布日期 2010.09.28
申请号 US20030367124 申请日期 2003.02.13
申请人 KLA-TENCOR TECHNOLOGIES CORPORATION 发明人 ADEL MICHAEL;GHINOVKER MARK;KASSEL ELYAKIM;GOLOVANEVSKY BORIS;ROBINSON JOHN C.;MACK CHRIS A.;POPLAWSKI JORGE;IZIKSON PAVEL;PREIL MOSHE
分类号 G01B11/00;G06K9/00;G01B21/00;G03F7/20;G03F9/00;H01L21/027;H01L21/66 主分类号 G01B11/00
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