发明名称 NOVEL POLYIMIDE SILICONE, PHOTOSENSITIVE RESIN COMPOSITION CONTAINING THE SAME, AND METHOD FOR PATTERN FORMATION
摘要 <P>PROBLEM TO BE SOLVED: To provide a polyimide silicone having a film excellent in fine pattern formation, film characteristics, and reliability as a protective film. <P>SOLUTION: The polyimide silicone, represented by formula (1), has a phenolic hydroxyl group in which a part or all of hydrogen atoms are substituted with an acid labile group, in the molecule. Wherein X is a tetravalent group and at least a part of which is a tetravalent organic group represented by formula (2) (wherein R<SP>1</SP>is a monovalent hydrocarbon group, R<SP>2</SP>is a trivalent group, and n is 1 to 120 on average), and Y is a divalent group, a group containing the phenolic hydroxyl group which experienced substitution with the acid labile group. <P>COPYRIGHT: (C)2010,JPO&INPIT
申请公布号 JP2010209265(A) 申请公布日期 2010.09.24
申请号 JP20090058944 申请日期 2009.03.12
申请人 SHIN-ETSU CHEMICAL CO LTD 发明人 TAGAMI SHOHEI;TAKEDA TAKANOBU;SUGAO MICHIHIRO;KATO HIDETO
分类号 C08G73/10;G03F7/004;G03F7/039;G03F7/075;H01L21/027 主分类号 C08G73/10
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