发明名称 COVERLAY FILM, METHOD FOR MANUFACTURING THE COVERLAY FILM AND FLEXIBLE PRINTED WIRING BOARD
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a coverlay film which has electromagnetic wave shielding function, is superior in flexibility, and with which a flexible printed wiring board can be thinned and a layer for shielding against electromagnetic noise is not necessary to be connected to the ground circuit of the flexible printed wiring board, and to provide a method of manufacturing the coverlay film and the flexible printed wiring board. <P>SOLUTION: The coverlay film 11 is provided with a base film 20, having a roughening face 21 (uneven face) formed in a part of one surface and a non-roughening face 22 (even face) except for the roughening face 21 and with an evaporated film 27, which is formed on a surface of the base film 20 on a side where the roughening face 21 is formed and is formed of a conductive material. <P>COPYRIGHT: (C)2010,JPO&INPIT</p>
申请公布号 JP2010212300(A) 申请公布日期 2010.09.24
申请号 JP20090054041 申请日期 2009.03.06
申请人 SHIN ETSU POLYMER CO LTD 发明人 KAWAGUCHI TOSHIYUKI;TAWARA KAZUTOKI;SAGA TSUTOMU
分类号 H05K3/28;H05K1/02;H05K9/00 主分类号 H05K3/28
代理机构 代理人
主权项
地址