| 摘要 |
PROBLEM TO BE SOLVED: To provide a double-layer flexible metal insulator laminated substrate high in adhesiveness, volume resistance, corrosion resistance, and insulation reliability, and excelling in an etching property; and a double-layer flexible wiring board high in reliability by employing the same. SOLUTION: In this double-layer flexible metal insulator laminated substrate, a base metal layer is formed directly on at least one surface of an insulator film without interposing an adhesive, a copper conductor layer is formed on a surface of the base metal layer, and a metal layer including the base metal layer and the copper conductor layer is formed. In the double-layer flexible metal insulator laminated substrate, the base metal layer is formed of an alloy containing copper, chromium and nickel, wherein the ratio of copper is 0.5-10 wt.%, that of chromium is 15-40 wt.% and that of nickel is 50-84.5 wt.%. In this double-layer flexible wiring board, circuit wiring is formed by subjecting the double-layer flexible metal insulator laminated substrate to etching processing. COPYRIGHT: (C)2010,JPO&INPIT |
